EV32C6A3A1-24.576M TR

EV32C6 Series REGULATORY COMPLIANCE 2011/65 + 2015/863 191 SVHC ITEM DESCRIPTION Voltage Controlled Quartz Crystal Clock Oscillators VCXO LVCMOS/TTL (CMOS) 3.3Vdc 6 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD) ELECTRICAL SPECIFICATIONS Nominal Frequency 1.544MHz to 77.76MHz Frequency Tolerance/Stability Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, Shock, and Vibration. ±50ppm Maximum Aging at 25°C ±2ppm/First Year Typical, ±10ppm/10 Years Maximum Operating Temperature Range Supply Voltage 0°C to +70°C -40°C to +85°C 3.3Vdc ±10% Input Current 15mA Maximum Output Voltage Logic High (VOH) IOH = -4mA 90% of Vdd Minimum Output Voltage Logic Low (VOL) IOL = +4mA 10% of Vdd Maximum Measured at 20% to 80% of Waveform 5nSec Maximum Measured at 50% of Waveform 50 ±10(%) 10TTL Load or 30pF LVCMOS Load Maximum over Nominal Frequency of 1.544MHz to 12.288MHz 15pF LVCMOS Load Maximum over Nominal Frequency of 12.288001MHz to 77.76MHz CMOS Rise/Fall Time Duty Cycle Load Drive Capability Output Logic Type Absolute Pull Range Control Voltage Range Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, Shock, Vibration, and Aging over the Control Voltage (Vc). ±50ppm Minimum ±80ppm Minimum (Only available over Nominal Frequency range of 1.544MHz to 51.84MHz) ±100ppm Minimum (Only available over Nominal Frequency range of 1.544MHz to 36MHz) Test Condition for APR 0.3Vdc to 3.0Vdc 0.0Vdc to Vdd Control Voltage Linearity 10% Typical, 20% Maximum Transfer Function Positive Transfer Characteristic Modulation Bandwidth Input Impedance Measured at -3dB, Vc = 1.65Vdc 10kHz Minimum 50kOhms Minimum Input Leakage Current 10µA Maximum Phase Noise All Values are Typical -70dBc/Hz at offset of 10Hz -100dBc/Hz at offset of 100Hz -130dBc/Hz at offset of 1kHz -147dBc/Hz at offset of 10kHz -152dBc/Hz at offset of 100kHz -155dBc/Hz at offset of 1MHz Tri-State Input Voltage (Vih and Vil) 90% of Vdd Minimum or No Connect to Enable Output, 10% of Vdd Maximum to Disable Output (High Impedance) Fj = 12kHz to 20MHz; Random 1pSec Maximum RMS Phase Jitter Revised N: 4/14/2014 Page 1 of 9 www.ecliptek.com EV32C6 Series Start Up Time 10mSec Maximum Storage Temperature Range -55°C to +125°C PART NUMBERING GUIDE ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V Fine Leak Test MIL-STD-883, Method 1014, Condition A Flammability UL94-V0 Gross Leak Test MIL-STD-883, Method 1014, Condition C Mechanical Shock MIL-STD-883, Method 2002, Condition B Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010, Condition B Vibration MIL-STD-883, Method 2007, Condition A Revised N: 4/14/2014 Page 2 of 9 www.ecliptek.com EV32C6 Series MECHANICAL DIMENSIONS SUGGESTED SOLDER PAD LAYOUT PIN 1 CONNECTION Control Voltage 2 Tri-State 3 Case Ground 4 Output 5 No Connect 6 Supply Voltage All Tolerances are ±0.1 All Dimensions in Millimeters Revised N: 4/14/2014 Page 3 of 9 www.ecliptek.com EV32C6 Series OUTPUT WAVEFORM & TIMING DIAGRAM Revised N: 4/14/2014 Page 4 of 9 www.ecliptek.com EV32C6 Series TEST CIRCUIT FOR CMOS OUTPUT Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass capacitor close (less Than 2mm) to the package ground and supply voltage pin is required. Note 2: A low capacitance (10Mohms), and high bandwidth (>300MHz) passive Probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. Revised N: 4/14/2014 Page 5 of 9 www.ecliptek.com EV32C6 Series TEST CIRCUIT FOR TTL OUTPUT Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass capacitor close (less Than 2mm) to the package ground and supply voltage pin is required. Note 2: A low capacitance (10Mohms), and high bandwidth (>300MHz) passive Probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. Note 4: Resistance value RL is shown in Table 1. See applicable specification sheet for 'Load Drive Capability'. Note 5: All diodes are MMBD7000, MMBD914, or equivalent. Revised N: 4/14/2014 Page 6 of 9 www.ecliptek.com EV32C6 Series TAPE & REEL DIMENSIONS Quantity per Reel: 1,000 Units All Dimensions in Millimeters Compliant to EIA-481 Revised N: 4/14/2014 Page 7 of 9 www.ecliptek.com EV32C6 Series RECOMMENDED SOLDER REFLOW METHOD HIGH TEMPERATURE INFRARED/CONVECTION TS MAX to TL (Ramp-up Rate) 3°C/Second Maximum Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum(TS MAX) - Time (ts MIN) 150°C 175°C 200°C 60 - 180 Seconds Ramp-up Rate (TL to TP) 3°C/Second Maximum Time Maintained Above: - Temperature (TL) - Time (tL) 217°C 60 - 150 Seconds Peak Temperature (TP) 260°C Maximum for 10 Seconds Maximum Target Peak Temperature(TP Target) 250°C +0/-5°C Time within 5°C of actual peak (tp) 20 - 40 Seconds Ramp-down Rate 6°C/Second Maximum Time 25°C to Peak Temperature (t) 8 Minutes Maximum Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. High Temperature Manual Soldering 260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised N: 4/14/2014 Page 8 of 9 www.ecliptek.com EV32C6 Series RECOMMENDED SOLDER REFLOW METHOD LOW TEMPERATURE INFRARED/CONVECTION TS MAX to TL (Ramp-up Rate) 5°C/Second Maximum Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum(TS MAX) - Time (tS MIN) N/A 150°C N/A 60 - 120 Seconds Ramp-up Rate (TL to TP) 5°C/Second Maximum Time Maintained Above: - Temperature (TL) - Time (tL) 150°C 200 Seconds Maximum Peak Temperature (TP) 240°C Maximum Target Peak Temperature(TP Target) 240°C Maximum 2 Times/230˚C Maximum 1Time Time within 5°C of actual peak (tP) 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time Ramp-down Rate 5°C/Second Maximum Time 25°C to Peak Temperature (t) N/A Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. Low Temperature Manual Soldering 185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised N: 4/14/2014 Page 9 of 9 www.ecliptek.com